Technical Articles / Article Series

Peer-Reviewed Publications

Explore selected peer-reviewed journal publications and scientific research results from AdMOS.

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Cryogenic-Aware EDA-Compatible Design Libraries for FD-SOI Transistors

Cryogenic-Aware EDA-Compatible Design Libraries for FD-SOI Transistors

Extending existing FD-SOI foundry libraries with temperature- and back-bias-dependent effects for seamless integration into established EDA design flows.

Conference 2026 10th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
Published 06.05.2026
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Evaluation of Cryogenic Model Libraries for FDSOI CMOS Transistors

Evaluation of Cryogenic Model Libraries for FDSOI CMOS Transistors

A cryogenic simulation library for FDSOI transistors enabling accurate device- and circuit-level modeling from 8 K to room temperature.

Journal IEEE Transactions on Electron Devices
Published 25.03.2026
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Cryogenic Performance Assessment of FD-SOI Transistors with Counter-Doped Channel

Cryogenic Performance Assessment of FD-SOI Transistors with Counter-Doped Channel

We explore counterdoping as a potential strategy to mitigate the increased threshold voltage at cryogenic temperatures, aiming to reduce power consumption.

Conference 2025 IEEE European Solid-State Electronics Research Conference (ESSERC)
Published 05.11.2025
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Compact model for the bias-depended low-frequency noise in organic thin-film transistors due to carrier-number and mobility-fluctuation effects

Compact model for the bias-depended low-frequency noise in organic thin-film transistors due to carrier-number and mobility-fluctuation effects

Combines carrier-number and mobility fluctuations in a charge-based compact noise model, validated using organic TFT measurements on flexible substrates.

Journal Organic Electronics
Published 01.09.2023
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THM-OTFT: A Complete Physics-Based Verilog-A Compact Model for Short-Channel Organic Thin-Film Transistors

THM-OTFT: A Complete Physics-Based Verilog-A Compact Model for Short-Channel Organic Thin-Film Transistors

Presents a comprehensive physics-based Verilog-A compact model for short-channel organic thin-film transistors, validated using measured device characteristics.

Journal IEEE Journal of the Electron Devices Society
Published 01.07.2023
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New Compact Modeling Solutions for Organic and Amorphous Oxide TFTs

New Compact Modeling Solutions for Organic and Amorphous Oxide TFTs

Reviews physics-based compact models for organic and oxide TFTs, covering charge transport, trapping, stress, capacitances, noise, and circuit simulation.

Journal IEEE Journal of the Electron Devices Society
Published 01.09.2021
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Compact Modeling of Nonlinear Contact Effects in Short-Channel Coplanar and Staggered Organic Thin-Film Transistors

Compact Modeling of Nonlinear Contact Effects in Short-Channel Coplanar and Staggered Organic Thin-Film Transistors

Introduces compact Schottky-contact barrier models that capture nonlinear source and drain contact effects in short-channel organic TFTs.

Journal IEEE Transactions on Electron Devices
Published 01.08.2021
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Compact Modeling of Short-Channel Effects in Staggered Organic Thin-Film Transistors

Compact Modeling of Short-Channel Effects in Staggered Organic Thin-Film Transistors

Develops physics-based compact models for subthreshold degradation, threshold roll-off, and drain-induced barrier lowering in short-channel organic TFTs.

Journal IEEE Transactions on Electron Devices
Published 01.11.2020
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Validation of the Industry-Standard ASM-GaN Model for Gate-Length Scaling

Validation of the Industry-Standard ASM-GaN Model for Gate-Length Scaling

Validates the ASM-GaN compact model against pulsed I-V measurements of AlGaN/GaN HEMTs with different gate lengths.

Conference 2020 4th Australian Microwave Symposium (AMS)
Published 13.02.2020
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Extreme Temperature Modeling of AlGaN/GaN HEMTs

Extreme Temperature Modeling of AlGaN/GaN HEMTs

Enhances the ASM-GaN compact model to capture GaN HEMT current-voltage behavior and trapping effects at temperatures up to 500 °C.

Journal IEEE Transactions on Electron Devices
Published 01.02.2020
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Consistent Surface-Potential-Based Modeling of Drain and Gate Currents in AlGaN/GaN HEMTs

Consistent Surface-Potential-Based Modeling of Drain and Gate Currents in AlGaN/GaN HEMTs

Extends the ASM-GaN compact model with consistent drain- and gate-current descriptions, including key leakage mechanisms across voltage and temperature.

Journal IEEE Transactions on Electron Devices
Published 01.02.2020
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Parameter Extraction and Compact Modeling of 1/f Noise for Amorphous ESL IGZO TFTs

Parameter Extraction and Compact Modeling of 1/f Noise for Amorphous ESL IGZO TFTs

Characterizes and models flicker noise in amorphous IGZO thin-film transistors using unified parameter extraction and noise-model validation.

Journal IEEE Journal of the Electron Devices Society
Published 01.01.2020
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Evaluation of a Spring Probe Card Solution for 5G WLCSP Applications

Evaluation of a Spring Probe Card Solution for 5G WLCSP Applications

Evaluates spring-probe-card architectures for 5G wafer-level chip-scale packaging using 3D electromagnetic simulations of millimeter-wave probing structures.

Conference 2019 International Wafer Level Packaging Conference (IWLPC)
Published 22.10.2019
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Towards Automatic Diagnosis of Minority Carriers Propagation Problems in HV/HT Automotive Smart Power ICs

Towards Automatic Diagnosis of Minority Carriers Propagation Problems in HV/HT Automotive Smart Power ICs

Presents an automated substrate parasitic extraction methodology to diagnose minority-carrier coupling and latch-up risks in high-voltage automotive smart power ICs.

Conference 2016 Design, Automation & Test in Europe Conference & Exhibition (DATE)
Published 14.03.2016
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Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards

Innovative solutions for systems based on embedding of thin components into flexible printed circuit boards

Presents approaches to embedding ultra-thin flexible silicon chips into polymer-based circuit boards, addressing bending reliability, handling, and assembly challenges in system-in-foil applications.

Conference 2015 European Microelectronics Packaging Conference (EMPC)
Published 14.09.2015
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A CAD Integrated Solution of Substrate Modeling for Industrial IC Design

A CAD Integrated Solution of Substrate Modeling for Industrial IC Design

Presents a CAD-integrated substrate-modeling approach for smart-power ICs to predict parasitic coupling between switching power stages and sensitive circuits.

Conference 2015 IEEE 20th International Mixed-Signals Testing Workshop (IMSTW)
Published 24.06.2015
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Analysis of Drain Bias Dependence of 1/f Noise in HV-MOSFETs

Analysis of Drain Bias Dependence of 1/f Noise in HV-MOSFETs

Examines drain-bias-dependent flicker noise in high-voltage N- and P-MOSFETs, distinguishing channel and drift-region contributions across operating regimes.

Conference 2015 International Conference on Noise and Fluctuations (ICNF)
Published 02.06.2015
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Modeling and Simulation Methodology for SOA-Aware Circuit Design in DC and Pulsed-Mode Operation of HV MOSFETs

Modeling and Simulation Methodology for SOA-Aware Circuit Design in DC and Pulsed-Mode Operation of HV MOSFETs

Presents a methodology for modeling the safe operating area of high-voltage MOSFETs under DC and pulsed conditions to support reliable circuit design.

Journal IEEE Transactions on Electron Devices
Published 01.02.2013
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Measurement and Compact Modeling of 1/f Noise in HV-MOSFETs

Measurement and Compact Modeling of 1/f Noise in HV-MOSFETs

Characterizes flicker noise in high-voltage MOSFETs over a broad range of biases and validates a physics-based compact model covering channel and drift-region noise.

Journal IEEE Transactions on Electron Devices
Published 01.02.2013
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Effects of Partially Broken HF Signal Return on Different Packaging Levels

Effects of Partially Broken HF Signal Return on Different Packaging Levels

Investigates how disruptions in high-frequency signal return paths affect electromagnetic coupling and signal integrity across different packaging levels.

Conference 2008 IEEE Electrical Performance of Electronic Packaging (EPEP)
Published 27.10.2008
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Long Range Connector Via Coupling Effects for High Speed Signals

Long Range Connector Via Coupling Effects for High Speed Signals

Investigates long-range coupling between connector vias using 3D electromagnetic simulations and time-domain measurements, highlighting its impact on high-speed signal integrity.

Conference 2007 IEEE Electrical Performance of Electronic Packaging (EPEP)
Published 29.10.2007
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Issues and challenges of Gbps backplane connector characterization

Issues and challenges of Gbps backplane connector characterization

Characterization of gigabit backplane connectors through 3D electromagnetic simulations, measurements, and de-embedding techniques, highlighting the impact of connector footprints on signal integrity.

Conference 8th IEEE Workshop on Signal Propagation on Interconnects
Published 09.05.2004
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